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| Surface Mount PPTC FSMD2920 Series FEATURES *2920 size, Surface mountable, *Application: All high-density boards *Operation Current: 300mA ~ 3.0A *Maximum Voltage: 6V ~ 60V *Temperature Range: -40C to 85C *RoHS Compliant RoHS u AGENCY RECOGNITION *UL (E211981) *C-UL (E211981) *TUV (R50090556) ELECTRICAL CHARACTERISTICS (23C) Part Number FSMD030-2920 FSMD050-2920 FSMD075-2920 FSMD100-2920 FSMD125-2920 FSMD150-2920 FSMD185-2920 FSMD200-2920 FSMD250-2920 FSMD260-2920 Hold Current IH, A 0.30 0.50 0.75 1.10 1.25 1.50 1.85 2.00 2.50 2.60 Trip Current IT, A 0.60 1.00 1.50 2.20 2.50 3.00 3.70 4.00 5.00 5.20 Rated Voltage VMAX, Vdc 60 60 33 33 33 33 33 16 16 6 Maximum Current IMAX, A 10 10 40 40 40 40 40 40 40 40 Typical Power Pd, W 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 Max Time to Trip Current Amp 1.5 2.5 8.0 8.0 8.0 8.0 8.0 8.0 8.0 8.0 Time Sec 3.0 4.0 0.3 0.5 2.0 2.0 2.5 4.5 16.0 20.0 Resistance Tolerance RMIN R1MAX OHMS 1.000 0.300 0.180 0.090 0.050 0.050 0.040 0.035 0.025 0.020 OHMS 4.80 1.40 1.00 0.41 0.25 0.23 0.15 0.12 0.085 0.075 IH=Hold current-maximum current at which the device will not trip at 23C still air. IT=Trip current-maximum current at which the device will always trip at 23C still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX). I MAX=Maximum fault current device can withstand without damge at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power disipated by the device when in the tripped state in 23C still air environment. R MIN=Minimum device resistance at 23C prior to tripping. R1MAX=Maximum device resistance at 23C measured 1 hour post trip. Termination pad characteristics Termination pad materials: Tin-plated copper FSMD2920 PRODUCT DIMENSIONS (MILLIMETERS) Part Number FSMD030-2920 FSMD050-2920 FSMD075-2920 FSMD100-2920 FSMD125-2920 FSMD150-2920 FSMD185-2920 FSMD200-2920 FSMD250-2920 FSMD260-2920 Min 6.73 6.73 6.73 6.73 6.73 6.73 6.73 6.73 6.73 6.73 A Max Min B Max Min C Max D Min 0.35 0.35 0.35 0.35 0.35 0.35 0.35 0.35 0.35 0.35 Side view C A Top and bottom view B D 7.98 4.80 5.44 0.60 1.15 7.98 4.80 5.44 0.60 1.15 7.98 4.80 5.44 0.35 1.15 7.98 4.80 5.44 0.40 1.00 7.98 4.80 5.44 0.40 0.90 7.98 4.80 5.44 0.40 0.90 7.98 4.80 5.44 0.30 0.90 7.98 4.80 5.44 0.30 0.90 7.98 4.80 5.44 0.30 0.90 7.98 4.80 5.44 0.30 0.90 RFE International * Tel:(949) 833-1988 * Fax:(949) 833-1788 * E-Mail Sales@rfeinc.com C5ED04 REV 2007.8.14 Surface Mount PPTC FSMD2920 Series THERMAL DERATING CURVE Thermal Derating Curve, FSMD Series Percent of Rated Hold and Trip Current 200% 150% 100% 50% RoHS u A B A= FSMD125 ~ FSMD260 B= FSMD030 ~ FSMD100 0% -40 -20 0 20 40 60 80 Ambient Temperature (C) TYPICAL TIME-TO-TRIP AT 23C A 100 10 Time-to-trip (S) BC D EFGHI A = FSMD030-2920 B = FSMD050-2920 C = FSMD075-2920 D = FSMD100-2920 E = FSMD125-2920 F = FSMD150-2920 G = FSMD185-2920 H = FSMD200-2920 I = FSMD250-2920 J = FSMD260-2920 1 0.1 0.01 0.001 0.1 1 Fault current (A) 10 100 PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS The dimension in the table below provide the recommended pad layout for each FSMD2920 device NOMINAL PAD DIMENSIONS (MILLIMETERS) Solder Reflow 20 to 40 Seconds 260 C Ramp-up 3C/Second Max 5.6 217 C f Ramp-down 6C/Second Max 200 C 150 C Preheat 25 C 60 to 180 Seconds 60 to 150 Seconds 2.3 5.1 2.3 Solder Reflow Due to "Lead Free" nature, up to 40 seconds dwelling time for the soldering zone is strongly recommended. 1. Recommended reflow methods; IR, vapor phase oven, hot air oven. 2. The FSMD Series are suitable for use with wave-solder application methods. (Top side only) 3. Recommended maximum paste thickness is 0.25mm. 4. Devices can be cleaned by using standard industry methods and solvents. 5. Storage Environment: <30C / 60%RH Caution: If reflow temperatures exceed the recommended profile, devices may not meet performance requirements. Rework: Use standard industry practices. NOTE: All Specification subject to change without notice. RFE International * Tel:(949) 833-1988 * Fax:(949) 833-1788 * E-Mail Sales@rfeinc.com C5ED04 REV 2007.8.14 |
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